This issue takes stock of the current economic outlook and how companies are using current conditions to move themselves through technological evolutions, workforce shifts, and financial changes. Even with these headwinds, there’s forward progress to be made.
To get different results in staffing, you must change how you define, promote and recruit your job opportunities. How do you become magnetic to high-quality early-career candidates? Heat Sink Paste
Test and inspection methods are undergoing rapid change. In this issue, we consider the influence of AOI, AI, and human eyes. How exactly are these pieces of the puzzle changing the role of test and inspection?
Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging (WLP/PLP).
Indium Corporation offers a robust portfolio of flux products designed for new or emerging industry challenges. To learn more about Indium Corporation’s fluxes, visit www.indium.com/ball-attach.
Thermally Conductive Structural Adhesive Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.